LATEST HEADLINES

• World Precision Instruments And SynVivo Launch Next-Generation Multiplexed TEER-On-A-Chip Platform For Real-Time Organ-On-A-Chip Cell Monitoring

  6/11/2025

  World Precision Instruments (WPI), a global leader in transepithelial electrical resistance (TEER) instrumentation, and SynVivo Inc., a pioneer in Organ-on-a-Chip (OOC) technology, today announced the commercial launch of a next-generation multiplexed TEER-on-a-Chip platform—a breakthrough solution enabling real-time, high-throughput measurement of barrier integrity in advanced Organ-on-a-Chip models.

• Infineon Collaborates With Typhoon HIL To Accelerate Development Of xEV Power Electronic Systems Using Real-Time Hardware-In-The-Loop Platform

  6/5/2025

  Infineon Technologies AG today announced a collaboration with Typhoon HIL, a leading provider of Hardware-in-the-Loop (HIL) simulation solutions, to provide automotive engineering teams with a fully-integrated, real-time development and test environment for key elements of xEV powertrain systems.

• Ranatec Introduces Panel-Mountable RI 4201 SuperSpeed USB 3.0 Feedthrough Filter

  6/3/2025

  Ranatec, a part of Qamcom Group and progressive creator of test and measurement equipment for RF and microwave applications, announced today the introduction of the RI 4201 USB 3.0 Feedthrough Filter.

• Measure The Impossible: Rohde & Schwarz Debuts Its Newest Test Solutions At IMS 2025 In San Francisco

  6/3/2025

  At the International Microwave Symposium IMS 2025 in San Francisco, Rohde & Schwarz will highlight its newest test instrument that will enable RF engineers to discover signals once out of reach.

• EECL Exhibits At IMS 2025

  5/29/2025

  EECL will be exhibiting for the first time at IMS 2025, the flagship event for the global RF and Microwave industry. The event runs from 15–20 June 2025 at the Moscone Center in San Francisco, California, and you’ll find us at Booth 154.